Top 550+ Solved Unconventional Machine Process (UMP) MCQ Questions Answer

From 151 to 165 of 641

Q. What range of powers are used for cutting through steel?

a. 1 to 20 w

b. 20 to 100 w c) 200 to 1000 w

  • c. d) 1 to 20 kw

Q. Which gas jet assisted process is suitable for most of the metals?

a. oxygen gas

b. nitrogen gas

c. helium gas

d. all of the mentioned

  • a. oxygen gas

Q. What happens to the cutting speed with an increase in the work piece?

a. increases

b. decreases

c. enhances

d. remains same

  • b. decreases

Q. What is the full form of LBT in the processes of LBM?

a. laser beam tempering

b. laser beam templating

c. laser beam texturing

d. laser beam tinning

  • c. laser beam texturing

Q. Depth and the crater size depends on which of them below?

a. energy of beam

b. dwell time of beam

c. energy & dwell time of beam

d. none of the mentioned

  • c. energy & dwell time of beam

Q. Where are the textured surfaces used that are obtained in LBT?

a. mould makings

b. bearings

c. printer roll manufacturing

d. all of the mentioned

  • d. all of the mentioned

Q. The roll is                    and the laser beam is moved                  along the roll.

a. stationary, axially

b. stationary, perpendicularly

c. rotated, axially

d. rotated, perpendicularly

  • c. rotated, axially

Q. Which of the following are the other applications of LBM?

a. dressing of grinding wheels

b. scribing

c. micromachining

d. all of the mentioned

  • d. all of the mentioned

Q. How the grooves in grinding wheels are produced using laser?

a. evaporation

b. damage of composite

c. evaporation & damage of composite

d. none of the mentioned

  • c. evaporation & damage of composite

Q. Work piece tilting depends on which of the following factors?

a. incident power

b. beam speed

c. groove direction

d. all of the mentioned

  • d. all of the mentioned

Q. Lasers of which type are used for modification of electronic components?

a. high power

b. small spot size

c. short pulse length

d. all of the mentioned

  • d. all of the mentioned

Q. Material removal rates which are about mg/pulse produces which type of holes?

a. shallow

b. deep

c. very deep

d. all of the mentioned

  • a. shallow

Q. Which of the following materials can be easily separated by laser scribing?

a. silicon

b. glass

c. ceramic

d. all of the mentioned

  • d. all of the mentioned

Q. Which type of holes can be drilled using Nd-YAG laser?

a. small holes

b. large holes

c. small & large holes

d. none of the mentioned

  • c. small & large holes
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