Top 350+ Solved Engineering Materials MCQ Questions Answer
Q. Brinell hardness number of mild steel should expected to be in the range be
a. 150-300
b. 110-150
c. 20--50
d. 300-450
e. 10-110
Q. The process of reheating hardened steel to temperature below the lower critical temperature followed by any desired rate of cooling, is known as
a. Hardening
b. Spheroidizing
c. Annealing
d. Tempering
e. Normalizing
Q. Gamma iron exists at temperatures in the range
a. Room temperature and lower critical temperature
b. Between 1400?C and 1600?C
c. Above 1600?C
d. Between 500?C and 850?C
e. Between 900?C and 1400?C
Q. Nitriding is a process for
a. Annealing
b. Spheroidizing
c. Case hardening
d. Normalizing
e. None of the above
Q. Polyethylene is produced by
a. Condensation polymerization
b. Addition polymerization
c. Colpolymerization of ethylene monomers
d. None of the above
e. Semi-conductors
Q. Which of the following rays are neither deflected by electric field nor by magnetic field?
a. ?-rays
b. ?-rays
c. ?-rays
d. X-rays
e. None of the above
Q. In drop forging the forging is done by
a. Dropping the workpiece at high velocity
b. Dropping the hammer at high velocity
c. Dropping the die with hammer at high velocity
d. Dropping a weight on hammer to produce requisite impact
e. None of the above
Q. The process of austempering results in the formation of
a. Carburized structure
b. Martensitic structure
c. Nitride structure
d. Bainite structure
e. Superhand structure
Q. Which of the following materials can be used for temperatures upto 500?C?
a. Empire cloth
b. Paper oiled
c. Mica
d. Polythene
e. None of the above
Q. The resistivity of electrical conductors is most affected by
a. Temperature
b. Pressure or composition
c. Composition
d. Pressure
e. Temperature and pressure
Q. The process of adding impurity to a semi-conductor material is called
a. Grouping
b. Mixing
c. Doping
d. Binding
e. Film deposition
Q. Which of the following material can be used at temperatures above 100?C?
a. Polythene
b. Teflon
c. Rubber
d. Paraffin wax
e. None of the above
Q. Which of the following method cannot be used for thermoplastic materials?
a. Extrusion
b. Blow moulding
c. Injection moulding
d. All of the above
e. None of the above